Microelectronics Assembly Process Engineer

Job Description
Microelectronics Assembly Process Engineer-TEK005219
Danaher Company Description
Bringing the Next Generation of Innovation Closer: Whenever you view a web site, use your tablet, or stream video, you touch our work. As a world leader in test, measurement and monitoring technology, we enable our customers to do more than they ever have. Technical innovators of all kinds benefit from our products and expertise. Our customers work in communications, computer, semiconductor, military/aerospace, consumer electronics, education, video and other fields all over the globe. Their reputations and success depend on our passion for solving their most complex measurement and monitoring problems. We help them monitor next generation devices and networks to ensure accurate performance, reliability, and compatibility. It's amazing what the right group of people can accomplish. No matter their experience or background, our dedicated associates work in tandem to deliver test and monitoring solutions; the very solutions that make innovations such as the explosive growth in global communication and Internet advanced technologies a reality. Welcome to Tektronix.

•Work closely with other engineering and manufacturing functions to ensure robust manufacturing processes are established and maintained for a wide variety of complex, high frequency microelectronic components.
•Work as part of a new product development team to develop and implement manufacturing processes, influence manufacturability, and communicate and manage technical risks.
•Provide process engineering support for existing products including process problem-solving, yield improvement, process monitoring, and cost reduction.


Minimum Requirements:
•Bachelor degree in Materials Science, Mechanical Engineering, Electrical Engineering, or related field
•5+ years of experience developing assembly processes for microelectronic components
•5+ years of experience directly supporting microelectronic component manufacturing operations

Preferred Requirements:
•Masters degree in Materials Science, Mechanical Engineering, Electrical Engineering, or related field
•Demonstrated hands-on experience in developing and supporting assembly processes for high frequency modules incorporating thin films, thick films, precision-machined housings, high frequency interconnects, mechanical assemblies, conductive adhesives, and solders
•Demonstrated hands-on experience in developing and supporting assembly processes for high-speed optical transceiver modules including optical fiber alignment, optical connectors, and hermetic sealing
•Familiarity with critical manufacturing requirements as they relate to RF/Microwave and optical product performance
•Experience working with high-compliance military products
•Experience in epoxy and eutectic die attach, wire bonding, encapsulation, flip chip, and hermetic sealing processes and equipment
•Experience with electronic materials, including conductive epoxies, solders, encapsulants, and underfills
•Experience applying problem-solving skills, statistical analysis, process control, and design of experiments principles
•Experience selecting, specifying, and qualifying manufacturing equipment
•Experience as a technical interface with customers from product concept through development phases

This position's primary/essential functions are subject to US Government ITAR compliance requirements under current government contracts. Therefore, all applicants must be either a US Citizen or a holder of a current valid Green Card and must provide proof of citizenship or legal residency via a birth certificate, a current valid green card, unexpired passport, or a naturalization certificate. We encourage applicants to bring such proof to their interview. However, in no case will applicants be allowed to begin their scope of work in this specific position without providing such proof.



Job Code

State or Province


Print  Close