Packaging Engineer

Job Description
Packaging Engineer - 729038
Job Description:
-This position will be working in the package substrate pathfinding team. Responsibility includes conducting fundamental research on material formulation, polymer bulk and surface properties; designing and implementing DOEs and performing data analysis; studying and understanding the interaction between polymer material surface and other materials;
-This position also requires to provide project management, package design/development and sustaining support for integrated circuit or semiconductor assemblies. Interacts with substrate/materials/equipment suppliers, and international travel is required for supplier

You must be current or recent graduate student with PhD. in Materials Science, Chemical engineering, or Polymer Science and Engineering.

Additional qualifications include:
-Demonstrate experience in polymerization, deformation of materials, and material development
-Demonstrate experience in fundamentals of materials science and engineering
-Demonstrate experience in handling analytical tools (such as SEM*, FTIR*, TMA*, DMA*, DSC*, TGA*, SIMS*, and mechanical testing machines)
-Demonstrate experience in relationship between processing versus microstructure versus mechanical and physical properties of materials (polymers, composites, metals and ceramics)
-Demonstrate experience in fracture and adhesion mechanisms of materials and material interfaces
-Experience in micro-fabrication including photolithography, thin film deposition, and dry/wet etching
-Familiarity with cleanroom environment and micro contamination control
- Background in photoresist materials development for contact/projection/laser direct imaging exposure

Job Category
: Engineering

Primary Location
: USA-Arizona, Phoenix

Full/Part Time
: Full Time

Job Type
: College Graduate

: Regular

Posting Date
: Mar 20, 2014

Apply Before
: Mar 20, 2015

Business Group As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to final test and optimization, and lastly packaging. Employees in the Technology and Manufacturing group are part of a worldwide network of manufacturing and assembly/test facilities.


Intel Corporation

Job Code

State or Province


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