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Trabaja en el Gobierno
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Working in Canada
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R&D Engineer-Device Encapsulation, Packaging
Next Energy Technologies, Inc. (NEXT) is startup developing a game-changing new ultra low-cost plastic solar technology. The flexibility, low-weight, color-tunability, and semitransparency of the technology will also fulfill unmet needs of niche solar markets. Successful applicants can expect exceptional opportunities and an exciting work environment where passion, teamwork, and results are core values.
NEXT is seeking an experienced electronic packaging engineer to help develop a new photovoltaic technology utilizing organic semiconductors. You will be working in a team to develop packaging solutions for photovoltaic devices targeted for various consumer markets. Your role is to work with internal device design, product design, supply chain, and external suppliers to develop and deploy new packaging/encapsulationsolutions. In addition, you will define packaging specifications and test final products against industry standards as well as internally specified benchmarks. We are looking for someone who excels in innovation but also has aproven track record to produce in a demanding R&D environment.
We are looking for strong mechanical engineering skills and experience with optics/semiconductors/electronic products in a high volume, high reliability manufacturing environment. This individualmust be able to solve complex engineering problems and be open to trying new ideas. They will be equally strong in PV module assembly and device reliability.
Day-to-day operations will consist of hands-on experimental work in a busy R&D laboratory environment, including:
§ Fabrication and testing of devices.
§ Development ofnew reliability test procedures and specifications, including instrumentation and methodology, to predict and control long-term performance in photovoltaic modules.
§ Analysis of statistical data to provide risk assessment of a design.
§ Systematic investigation of possible failure modes.
§ Prioritization and completion of tasks to meet deadlines.Interface and coordination with other team members to comply with product development/ramp timeline and to enable packaging milestones on time.
§ Communication ofexperimental results with interdisciplinary teams in order to improve product reliability.Preparation of concise, detailed test reports and maintenance of well-documented lab notebooks.
§ Development of photovoltaic module assembly process. This includes, but not limited to, the initial proof of concept demo work, novel process, equipment and materials development work, and yield analysis and enhancement work. Development of new and improved manufacturing processes that require innovation and ingenuity. Development of packaging roadmap based on long-term packaged product requirements, and managementof the supplier’s R&D activities.
Technical skills desired:
§ Experience in fabrication of encapsulated devices
§ Experience performing reliability testing including light soaking, damp heat, thermal cycling, mechanical cycling, etc.
§ Knowledge of failure analysis analytical techniques (Optical Microscopy, AFM, X-Ray, SEM/EDS, FTIR, XPS etc)
§ Ability to use fundamental failure analysis methodology to derive a root cause of failure
§ Knowledge of industry test standards (IEC, ASTM, IEEE)
§ Solid understanding of mechanical assemblies
§ Application of DOE (Design of Experiments) and FMEA (Failure Modes an Effects Analysis)
§ Physical requirements include: being able to stand for extended periods during the day, lifting up to 50 lbs, bending, twisting, reaching, and grasping while working with fabrication equipment. Additional requirements include the ability to precisely manipulate small (10 mm) wafers, use tweezers, align masks, strip and solder small wires and electronic parts.
§ Hands-on knowledge of PV module (or similar technology) assemble steps and PV materials such as solders, conductive pastes, edge-seals, adhesives, UV-cured epoxies, ITO, FTO, PDMS, PET, PEN, PTFE, EVA, desiccants, and processes such as roll coating, blade coating, solvent bath cleaning, spin coating, roll and hot-press lamination. Advanced knowledge in organic semiconductors, organic optoelectronic devices, flexible electronics, flexible thin-film photovoltaics is a plus.
§ Experience with encapsulation of organic semiconductors is a plus.
§ Significant experience in design and fabrication of purpose-built testing fixtures and remote or automated data collection systems. Additional knowledge in computer programming to automatically collect and analyze large data sets highly desired.
§ Experience with testing and fabrication in inert atmosphere (MBraun and VAC gloveboxes), vacuum thermal film deposition, basic optical thin-film characterization (profilometery, UV-VIS-NIR absorption, interferometry), and thin-film electronic characterization.
§ Demonstrated ability to maintain detailed experimental records, author SoPs, and manage long-term statistical analysis of continuous processes.
§ Proven track record to bring a product from conceptual stage to fully specified product.
§ Excellent written and verbal communication skills. Able to present ideas, design concepts, data and plan with high confidence at team meetings and executive review meetings.
§ Able to perform in a collaborative work environment, handle constructive input and feedback from multidisciplinary team members. Capable of independent research and development work with minimal supervision.
§ B.S., M.S or Ph.D. degree in mechanical engineering, physics, materials science or similar disciplines with a minimum of 5 years of packaging/encapsulation/reliability experience. AutoCAD, Solid Works, LabView, Python, IgorPro, Matlab, MiniTab and multiphysics simulation knowledge is a plus.
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